Nvidia has introduced NVLink Fusion, a new chip interconnect technology designed to significantly accelerate processor-to-processor communication, marking a strategic leap beyond its role as a chipmaker. The technology, unveiled by CEO Jensen Huang at Computex 2025 in Taipei, symbolizes Nvidia’s ambition to become the backbone of global AI infrastructure. NVLink Fusion is engineered to deliver data transfer speeds up to 14 times faster than PCIe, which is expected to enhance the performance of AI models during both training and inference at scale.
In a major shift, Nvidia is opening up its interconnect fabric to rival chipmakers, allowing them to integrate NVLink Fusion into their own AI systems. This move brings external AI chip developers into Nvidia’s ecosystem, enabling seamless processor interconnectivity previously exclusive to Nvidia’s platforms. Industry players like Marvell Technology and MediaTek have already committed to using the technology, signaling strong early adoption and trust in its capabilities. Partnerships with other tech giants such as Qualcomm, Fujitsu, and Synopsys further broaden NVLink Fusion’s ecosystem potential.
Beyond interconnect technology, Huang also announced Nvidia’s next wave of AI chips, which includes the Blackwell Ultra set to launch later in 2025, followed by Rubin and a new family named Feynman due in 2028. These product milestones reflect Nvidia’s long-term roadmap to maintain its leadership in the rapidly evolving AI industry. Meanwhile, the company confirmed its DGX Spark desktop AI computer is now in full production and will be available for researchers within weeks, bolstering its commitment to serve the growing demand for edge AI computing.
Nvidia is also strengthening its regional presence in Asia, with plans to establish a new headquarters in the northern suburbs of Taipei. This development underscores both commercial intent and strategic positioning as global semiconductor influence continues to shift toward Asia. Computex 2025, which hosted over 1,400 exhibitors, marked the robust return of international chipmakers to the region, following recent disruptions from geopolitical tensions and U.S. tariff policies that have reshaped global supply chains.